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Snapdeal.com is an online commercial center, New Delhi, India. The organization was begun by Kunal Bahl, a Wharton graduate as a component of the double degree M&T Engineering and Business program at Penn, and Rohit Bansal, a former student of IIT Delhi in February 2010.
Organization Name: Snap Deal
Assignment: Application Engineer
Site: www.snapdeal.com
Capability: B.E, B.Tech, MCA, MCM, P.G.D.C.A Graduates
Work Location: New Delhi
Compensation Offered: INR 3, 00,000/ - LPA to INR 4, 50,000/ - LPA
Experience: 0-2 Years
Occupation Type: Full-Time
Industry: IT/ Software Services
Aptitudes: Good learning of Data structure & Algorithms Must have great information any of programming dialect (Python, Java, PHP),
Work Responsibilities:
Improvement of new dashboards that pander to changing business needs
Getting & organizing information to be shown on these dashboards
Support of these new dashboards & Solving business confronting unstructured issues.
Bond-: No Bond/No Contract
Tentative date of joining: Immediate
Interview Process:
Written Test
Multiple Technical interview rounds followed by HR round.
Snapdeal.com is an online commercial center, New Delhi, India. The organization was begun by Kunal Bahl, a Wharton graduate as a component of the double degree M&T Engineering and Business program at Penn, and Rohit Bansal, a former student of IIT Delhi in February 2010.
Organization Name: Snap Deal
Assignment: Application Engineer
Site: www.snapdeal.com
Capability: B.E, B.Tech, MCA, MCM, P.G.D.C.A Graduates
Work Location: New Delhi
Compensation Offered: INR 3, 00,000/ - LPA to INR 4, 50,000/ - LPA
Experience: 0-2 Years
Occupation Type: Full-Time
Industry: IT/ Software Services
Aptitudes: Good learning of Data structure & Algorithms Must have great information any of programming dialect (Python, Java, PHP),
Work Responsibilities:
Improvement of new dashboards that pander to changing business needs
Getting & organizing information to be shown on these dashboards
Support of these new dashboards & Solving business confronting unstructured issues.
Bond-: No Bond/No Contract
Tentative date of joining: Immediate
Interview Process:
Written Test
Multiple Technical interview rounds followed by HR round.
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